Are you prepared to help develop the next generational advancement in memory? At Micron, we are the world's leader in sophisticated memory technology! As Capacitor Advanced Module Integration Engineers for the Process R&D organization, we are responsible for leading the efforts in developing new modules for the next three to four generations of DRAM technology nodes! As module owners, we define the requirements for one or more modules and work with unit process areas and supporting teams, as well as other module owners to integrate your module with the entire flow.

Position levels range from Principal Engineer to Senior Member Technical Staff to Distinguished Member Technical Staff. Level of offer will be determined by background, experience, and education.

Responsibilities include, but not limited to:

• Develop and improve various process module including design rules, structural and electrical specifications for alternative flows
• Optimize existing process flows and develop creative solutions to meet product requirements
• Design and implement DOEs and analyze results with statistical analysis software like JMP. Feedback results to product for yield improvement.
• Extract, supervise, analyze, and react to inline data, defect data, param data and probe data to fix yield issues, performance, reliability, add process margin and reduce costs
• Work multi-functionally with Design, Product Engineering, Modeling, Yield Improvement and Electrical and Physical Failure analysis teams, Defect Analysis, Param, and Quality teams to understand issues, targets, and priorities for new module development
• Summarize sophisticated problems, derive, explain actions taken to address them and drive team to implement
• Ensure timely documentation of R&D activities in your module for transfer to node development team and Manufacturing

Education and Experience:

Minimum Qualifications:

• M.S. or PhD (Electrical Engineering, Microelectronics, Physics, or Material Science) or B.S. with 5 years demonstrated ability.
• Basic knowledge of semiconductor device Physics.

Preferred Experience:

• 5 years industry experience in process integration or a role that interacts with process integration and has a strong understanding of process integration requirements.
• 2 years experience DRAM manufacturing fab and/or DRAM transfer team experience.
• Experience in Local Interconnect and Middle of Line DRAM modules.
• Device Physics, Electronics or Electrical Engineering background highly preferred